Low-Pressure Injection Molding

The mainstreaming of the low-pressure injection molding machine is a matter of the present age. Typically, it is a process that uses hot liquified polyamide and polyolefin materials. It paves the way to protect vulnerable components prone to moisture, vibration, and dust particles and makes them flame retardant and temperature resistant. It uses reduced pressure to inject plastic into the mold and usually suitable for printed circuit boards (PCBs), cable assemblies, and sensors.

Paradoxically, conventional or high-pressure molding is slightly different from low-pressure molding and suitable for the components made to endure increased pressure. Plastic is infused at high pressure and turns into more intricate structures, providing many customized solutions. However, it involves pressures and temperatures that may damage delicate components like PCBs. 

Meanwhile, when dealing with low-pressure injection molding, pressure is kept at 100PSI. Simultaneously, the temperature ranges between 180-220°C, and the melt flow time are 10 minutes for 5 grams. 

Low-Pressure Molding in Overmolding

Overmolding refers to an injection molding process that brings about a consistent amalgamation of different materials into a solitary product. In other terms, overmolding is a process wherein formerly molded parts are re-inserted to develop a new plastic layer around the component.

The process of overmoldingincludes unprotected PCBs, loading bare, and cable assemblies into a precision-crafted tool. The cavity is then filled with a suitable low-pressure molding material. Also, it helps manufacturers encapsulate delicate components according to their requirements and have a protected and sealed product.

The low-pressure injection molding process is used in overmolding and micro injection molding to protect weak components that allow gentle protection for them (electronic assemblies). It utilizes thermoplastic materials with relatively low viscosity that permits encapsulation and overmolding of sensitive and printed circuit board assemblies. 

Since the materials used in the process are entirely adhesive in nature, this process proves to be the most feasible solution to seal circuits against moisture and dust. insert molding

By Admin

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